Automotive HD Link (AHL) Enables Low-Cost Cables and Connectors to Transmit HD Video; Complements Other Renesas Products in Auto Safety Systems.

AI Workbench Empowers a Shift-Left Approach to Software Development and Decouples Software Design from Chip Availability.

Future Offerings to Include R-Car SoCs with Advanced In-Package Chiplet Integration Technology and Arm-Based Automotive MCUs.

Renesas Electronics, has announced that they have agreed to jointly design automotive-grade gateway solutions for the rapidly-growing electric vehicle (EV) market.

Renesas Electronics and Wolfspeed have signed a wafer supply agreement and $2 billion deposit to secure a 10-year commitment to supply silicon carbide bare and epitaxial wafers from Wolfspeed.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced today a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles, addressing the requirements of next-generation E/E (electrical/electronic) architectures.

Shorten Development Cycles by Enabling Rapid Development of Optimized Network Models and High-Speed Simulation.

Highly Integrated RAA271082 PMIC Complements Renesas’ Award-Winning AHL Technology; Flexibility Enables Support for MCUs in Safety-Related Applications.

New Integrated Software Development Environment Supports Multi-Chip ECUs, Reducing Development Time and Post-Design Modifications.

VinFast, Vietnam’s first global EV maker, and Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that the two companies are expanding their collaboration agreement to include automotive technology development of electric vehicles (EVs) and delivery of system components.