Infineon and Lingji’s MoU focuses on developing CoolGaN G5-based inverters for 48V-72V light electric vehicles, enhancing power density and efficiency for shared mobility and high-end models.

New production-ready AUTOSAR drivers, safety libraries, and DSP tools accelerate ECU development and meet highest ASPICE, ISO26262, and ISO21434 standards.

The new automotive MOSFET family, based on Infineon's 6th generation OptiMOS technology, offers two different drain-source resistance levels across all device variants.

Infineon’s XENSIV 3D magnetic Hall sensors offer ASIL-B support, ±160 mT range, and low power for high-precision positioning across multiple industries.

Infineon expands PSOC 4 HV microcontroller platform with PSOC 4 HVMS product family, optimized for space-constrained sensing or actuator applications.

Infineon’s XENSIV TLE4802SC16-S0000 enables high-accuracy torque sensing for EPS and chassis systems, featuring SENT/SPC output and ISO 26262 compliance.

Infineon’s AURIX MCUs and Typhoon HIL’s real-time simulators enable seamless testing of xEV power electronics, cutting development cycles and costs for motor drives, BMS, and chargers.

The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.

Infineon Technologies announced that the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.

Infineon’s new MOSFETs feature ultra-low RDS(on), superior thermal performance, and high switching efficiency, making them ideal for EV and industrial applications such as chargers, converters, eFuses, and solid-state relays.