Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play an important role in in-vehicle monitoring systems.

Autonomous and automated driving is a megatrend in the automotive industry, along with electrification.

Trucks automatically driving behind one another on the highway, 'platooning', or cars automatically changing lanes: Here vehicle movements have to be calculated and executed precisely and quickly without a human driver.

Infineon's current sensor ICs and Swoboda's sensor module expertise are being combined to address the growing market of sensing solutions for hybrid and electric vehicles.

Infineon Technologies AG is expanding its portfolio of next-generation OptiMOS™ 7 MOSFETs for automotive applications: the portfolio of 40 V products now includes additional devices in robust, lead-free packages.

Infineon Technologies AG introduced the 600 V CoolMOS™ S7TA Superjunction MOSFET for automotive power management applications.

Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Infineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC & bare die products to Xiaomi EV for its recently announced SU7 until 2027.

With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip.

As the automotive industry transitions to software-defined vehicles and new E/E architectures, the demand for high-performance hardware and robust cybersecurity solutions increases.