Infineon Technologies AG and the Austrian product compliance company Kontrol are entering into a strategic partnership to make the future of mobility as both legally compliant and safe as possible.

Infineon is expanding its automotive microphone portfolio with the introduction of the XENSIV MEMS microphone IM68A130A, designed for ANC systems with an analog interface.

Infineon Technologies AG introduces two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466, both targeted at automotive applications. While the KP464 is primarily designed for engine control management, the KP466 BAP sensor is intended for seat comfort functions.

Infineon Technologies AG and Autotalks announced today that the two companies are collaborating to deliver solutions for next-generation V2X (Vehicle-to-Everything communication) applications.

Infineon Technologies AG extends its AURIX TC3xx MCAL by adding support for AUTOSARv4.4.0 to the existing AUTOSARv4.2.2 MCAL.

Infineon Technologies AG the global leader in automotive semiconductors and Hon Hai Technology Group aim to establish a long-term partnership in the field of electric vehicles to jointly develop advanced electromobility with efficient and intelligent features.

Infineon Technologies AG announced the OptiMOS 7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in a variety of lead-free and robust power packages.

Infineon Technologies AG introduces the EZ-PD CCG7D, a dual-port USB-C power delivery (PD) solution with integrated boost controller for in-car charging applications.

Infineon Technologies AG launched a new automotive power module: The HybridPACK Drive G2.

The STABL solution connects discarded batteries to the public power grid, even in larger quantities, without a central inverter.