New D2PAK-7 packaged silicon carbide MOSFETs set industry benchmarks, delivering high performance and reliability for next-gen automotive power applications.

Nexperia unveils 16 automotive planar Schottky diodes in CFP2-HP packaging, offering low VF, efficient heat dissipation, and flexibility for automotive, industrial applications.

Nexperia’s new flip-chip ESD protection diodes offer ultra-low capacitance, high signal integrity, and space-saving design for automotive data links.

This release addresses the market demand from automotive manufacturers for ICs that can help systems achieve ASIL-B compliance much earlier in the design cycle.

Nexperia's 1200 V SiC MOSFETs in X.PAK packaging offers superior thermal performance, top-side cooling, and efficiency for industrial and EV charging applications.

Nexperia has launched a new series of AEC-Q100 qualified low-dropout (LDO) voltage regulators with ultra-low quiescent current.

Nexperia introduces a new range of automotive-qualified MicroPak XSON5 logic ICs, offering 75% PCB area savings and side-wettable flanks, making them ideal for space-constrained automotive applications.

Nexperia has introduced a new series of high-performance gate driver ICs, designed to drive N-channel MOSFETs in synchronous buck or half-bridge configurations, enhancing efficiency and robustness in applications.

Nexperia and KOSTAL are partnering to develop silicon carbide MOSFETs for electric vehicle onboard chargers, leveraging Nexperia's wide bandgap semiconductor expertise and KOSTAL's industry insights.

50 μA and general-purpose devices offer package flexibility for automotive and non-automotive applications.