The new MLX90376 is an absolute magnetic position sensor IC, handling 360° rotary automotive applications with strong stray field immunity (SFI). Its dual-stacked die PCB-less version is unique to the market.
Murata has broadened its portfolio of chip ferrite beads with the introduction of the BLM15PX_SH1 and BLM15PX_BH1 series. Supplied in a 1005 mm (0402 inch) size, these compact and rugged units are highly optimised for automobile deployment.
Rohde & Schwarz and Nothing Technology announce their joining of forces in the R&D process to validate the 5G multiband aggregation and the application layer performance for Nothing Technology’s new Phone (1) with the R&S CMX500 one-box signaling tester.
VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.
The BMW Group is commencing production of its BMW iX5 Hydrogen model. Manufacture of the small-series hydrogen-powered vehicle is taking place in the pilot plant at its Munich Research and Innovation Centre.
Photonics focuses on the use of light with all its possibilities. From light control to laser technologies and data transmission, photonics is used in many fields such as medicine, industry, astronomy, microscopy or traffic safety. One of the leading research institutes in this field is the Dresden Fraunhofer Institute for Photonic Microsystems IPMS.
Zeleros, the Spanish deep-tech company developing the scalable hyperloop, has been awarded 2.8 million euros under the +50M€ traction project HUB-dCO2 PERTE-VEC to design a battery pack for high-performing e-mobility sectors.
Together with its partner Löhnert Elektronik, Rohde & Schwarz has introduced a fully automated turnkey solution for bumper production radar transparency testing based on the successful R&S QAR50. The lightweight and compact setup of the R&S QAR50-R facilitates precise positioning of the measurement antennas, allowing faster, more accurate and convenient testing. This leads to higher throughput and yeilds as well as more flexiblity to adapt to different DUTs, for End-of-line (EOL) measurements of bumpers and other exterior parts.
Dana Incorporated today announced that it has signed a long-term agreement with Semikron Danfoss, one of the world's leading manufacturers of power modules, to secure the supply of silicon-carbide semiconductors, which are designed to be scalable in multiple-chip formats.