Infineon expands PSOC 4 HV microcontroller platform with PSOC 4 HVMS product family, optimized for space-constrained sensing or actuator applications.

Infineon’s XENSIV TLE4802SC16-S0000 enables high-accuracy torque sensing for EPS and chassis systems, featuring SENT/SPC output and ISO 26262 compliance.

Infineon’s AURIX MCUs and Typhoon HIL’s real-time simulators enable seamless testing of xEV power electronics, cutting development cycles and costs for motor drives, BMS, and chargers.

The R2 platform will use silicon carbide (SiC) and silicon (Si) modules from Infineon’s HybridPACK Drive G2 family. Supply is expected to start in 2026.

Infineon Technologies announced that the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains.

Infineon’s new MOSFETs feature ultra-low RDS(on), superior thermal performance, and high switching efficiency, making them ideal for EV and industrial applications such as chargers, converters, eFuses, and solid-state relays.

Infineon and Marelli partner to enhance in-car displays with MEMS laser beam scanning, showcased at Auto Shanghai 2025.

As vehicle architectures transition to hybrid and electric models, conventional battery systems are increasingly being supplemented or replaced by 48 V power sources.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a significant milestone in automotive cybersecurity. The company received ISO/SAE 21434 certification for its AURIX™ TC4Dx microcontroller.

The automotive industry is facing significant technological challenges in developing new and innovative features and services.