Infineon Technologies AG, based in Germany, is a global leader in semiconductor solutions with core expertise in power systems, automotive electronics, and IoT applications. Its portfolio includes microcontrollers, sensors, and power semiconductors, enabling smarter and safer electronics. Infineon supports energy-efficient mobility, smart buildings, and secure communications. Committed to sustainability, Infineon plays a central role in shaping green technology through innovation and advanced chip design across multiple industries.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has developed a security solution for automotive wireless charging: OPTIGA Trust Charge automotive complies with version 1.3 of the Wireless Power Consortium (WPC) Qi standard, which requires strong cryptographic authentication for wireless charging up to 15 W.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has joined the FiRa Consortium as a Contributor member to support the expansion of the UWB ecosystem. FiRa is dedicated to developing and widely disseminating ultra-wideband (UWB) technology for secured fine ranging and positioning capabilities in a wide range of applications.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its first automotive current sensor: the new XENSIV TLE4972. The coreless current sensor uses Infineon’s well-proven Hall technology for precise and stable current measurements.
With increasing electrification and connectivity, vehicles are at greater risk of cyberattacks, which can have serious consequences. For this reason, it is crucial that automotive manufacturers provide adequate protection of telematics data.
With trends such as electrification, autonomous driving and connected cars, the number of communication interfaces in vehicles is growing – whether wired or wireless. However, this development entails new challenges because the numerous communication channels create new attack surfaces increasing the vulnerability of the systems.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the automotive qualified EasyPACK 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A rms. With its featured specs, the module is optimized for inverter applications in hybrid and electric vehicles.
Infineon Technologies AG today officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto “Ready for Mission Future.”
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is also tailored for commercial, construction and agricultural vehicles (CAV) as well as for uninterruptible power supply (UPS) inverters.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Robert Bosch GmbH are launching a new ultra-low-loss diode called Active Rectifying Diode for light vehicle generators.
What if your everyday eyeglasses became the next media for augmented reality applications? What if every car could display valuable data on the whole windshield to securely guide you through the traffic? The new MEMS* scanner solution from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), comprising a MEMS mirror and MEMS driver, allows completely new product designs. Its miniature size and low power consumption are the basis for making augmented reality (AR) solutions more widely available for consumer applications such as wearables and for automotive head-up displays.