OPS3 sensor provides top performance in harsh environments, simplifies manufacturing and scales the production capacity needed to meet increasing market demand.
BorgWarner’s integrated drive module (iDM) was selected by the Hyundai Motor Group for its power electric system, which will be used in the upcoming A-segment electric vehicle production, planned to start in mid of 2023.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications.
As a continuation from the recently completed SCA project, the TAM project aims to eliminate important cybersecurity bottlenecks in the communications of autonomous, connected and cooperative mobility systems. It will address new use cases related to autonomous cars and shuttles.
NXP Semiconductors N.V. (NASDAQ: NXPI), a world leader in automotive processing, and TSMC (TWSE: 2330, NYSE: TSM) today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.
The third ‘Novares Venture Day’ took place yesterday – an event where start-up companies in the innovation sector pitch their ideas to an expert jury and the winners get the chance to work with Novares and see their innovations used in real applications in the automotive sector.