AEC-Q200 qualified MKP1848 series delivers low ESR, high ripple current, and long life—supporting electrification, renewable energy, and high-efficiency power conversion.
HERE Technologies and Amap partner to deliver next-gen AI navigation, digital cockpit, and assisted driving solutions for Chinese EVs expanding into global markets.
The new TLE994x and TLE995x SoCs integrate control, diagnostics, and security in one chip, supporting efficient, compact, and safe brushed and brushless motor applications.
Merging HighTec’s ISO 26262-certified compilers with Quintauris’ RISC-V platforms, the partnership accelerates safe, high-performance automotive development and strengthens interoperability across real-time embedded systems.
NXP unveils an industry-first BMS chipset, synchronized cell measurements, enhancing EV battery health monitoring, safety, and fast charging capabilities.
FORVIA's new On-demand center console, featuring the patented MoodPlug platform, allows tool-free interior module swaps, promoting user customization, comfort, and lifecycle sustainability for OEMs and drivers.
ZF strengthens its aftermarket ecosystem connecting OE parts, digital tools, service and training to help distributors, fleets and workshops keep vehicles on the road.